DPC technology (Direct Plated Copper)

DPC technology (Direct Plated Copper)

Stapes of the technological process:

1. Formation of a thin continuous film of conductive material on a ceramic substrate. In this case, there may be holes in the substrate;

2. Applying a photoresist to the formed conductive layer;

3. Exposure and manifestation of photoresist;

4. Galvanic build-up of copper metallization of the required thickness;

5. Application of Ni-Au finish coating;

6. Removing the photoresist from the surface of the board;

7. Chemical etching of the conductive layer remaining on the ceramic after removing the photoresist.

Specifications

Application area